EVG September 2021 Clip Report
TABLE OF CONTENTS:
Date		Source		Headline
9/1/21	EUROBIZ (Japan)		A reputation for innovation
9/7/21	MDPI		Silicon Metalens Fabrication from Electron Beam to UV-Nanoimprint Lithography
9/8/21	Electronics Weekly		Applied Materials improves die-to-wafer and wafer-to-wafer bonding
9/8/21	i-Micronews		Applied Materials introduces new technologies and capabilities for accelerating the semiconductor industry’s heterogeneous integration roadmap
9/8/21	Market Screener		Applied Materials : The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips | MarketScreener
9/8/21	vlsiresearch		Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry’s Heterogeneous ...
9/9/21	Biglobe News (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	BtoB Channel (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	CNET (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Elektroniknet.de		3D-IC-Integration: Applied Materials und EVG kooperieren
9/9/21	Excite (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Gendai (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Infoseek News (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Japan Business Press (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Jordan News (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Link Magazine		Samenwerking Besi en Applied resulteert in ‘versnelling’ roadmaps klanten
9/9/21	Newsweek (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Nico Nico news (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	PR TIMES (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	President Online (Japan)		Applied Materials Introduces new technologies and solutions that accelerate the semiconductor industry roadmap for heterogeneous integration
9/9/21	Straight Press (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	Techable (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/9/21	ZDNet (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/10/21	China Electronic Business (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	China Electronic Technology Application (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	China Integrated Circuit Network (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	EDACafe.com Blog		New fabs; Tesla training system; GaN CMOS; CUDA on Risc-V; Y Combinator startups - EDACafe Editorial
9/10/21	eeFocus (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	Elecfans (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	Semiconductor Engineering		Week In Review: Manufacturing, Test
9/10/21	Silicon Semiconductor (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/10/21	Torema News (Japan)		Applied Materials Introduces New Technologies and Solutions to Accelerate the Semiconductor Industry Roadmap for Heterogeneous Integration
9/11/21	EE Times (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/12/21	Compotech (Trad) (Taiwan)		Applied Materials launches new technologies and capabilities to accelerate the semiconductor industry's roadmap for heterogeneous integration technology
9/12/21	CompoTech Asia (Taiwan)		Applied Materials launches new technologies and capabilities to accelerate the semiconductor industry's roadmap for heterogeneous integration technology
9/12/21	EEPW (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/12/21	Electronics Journal		Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry’s Heterogeneous Integration Roadmap
9/13/21	CTimes (Taiwan)		Applied Materials Accelerates the Semiconductor Industry's Heterogeneous Integration Roadmap
9/13/21	DigiTimes (Taiwan)		Applied Materials Unveils Three New Technologies for Chiplet Packaging
9/13/21	Economic Daily News (Taiwan)		Applied Materials Launches Three Advanced Packaging Technologies and Announces a Joint Development Agreement with EVG
9/13/21	Instrument Information Network (China)		Applied Materials launches new technologies and capabilities to accelerate the semiconductor industry's roadmap for heterogeneous integration technology
9/13/21	MDPI		Applied materials accelerate the semiconductor industry to realize the blueprint of heterogeneous integration technology
9/13/21	Printed Electronics Now		SCHOTT Drops Weight of Augmented Reality Glass by 20%
9/13/21	TechNews (Taiwan)		Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry's Heterogeneous Integration Technology
9/13/21	Toutiao (China)		Accelerate the realization of heterogeneous integration technology in the semiconductor industry, and introduce new technologies and capabilities
9/13/21	UDN (Economic Daily News) (Taiwan)		Applied Materials Launches Three Advanced Packaging Technologies and Announces a Joint Development Agreement with EVG
9/14/21	Asia Electronics Industry (Japan)		New Technologies Boost Chip Design, Integration
9/14/21	Commercial Times (Taiwan)		Applied Materials Unveils New Technologies to Accelerate the Semiconductor Industry's Heterogeneous Integration
9/14/21	EDACafe.com		MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges
9/14/21	EE Times (China)		Applied Materials - Technology blueprint for accelerating the design and integration of heterogeneous chips
9/14/21	ETToday (Taiwan)		Applied Materials Launches Three New Technologies for 'Heterogeneous Integration' and Announces a Joint Development Agreement with EVG
9/14/21	Glass Global (ENG)		Longer wear & deeper immersion: SCHOTT drops weight of Augmented Reality glass by 20%
9/14/21	Money Link (Investor) (Taiwan)		The Leader in Materials Engineering Solutions for the Semiconductor - Applied Materials - Introduces Three Technologies for Accelerating Heterogeneous Integration
9/14/21	NetEase (China)		Applied Materials Launches New Technologies and New Functions to Accelerate the Heterogeneous Integration Roadmap of the Semiconductor Industry
9/14/21	Sohu.com (China)		Applied Materials - Technology blueprint for accelerating the design and integration of heterogeneous chips
9/14/21	VLSIresearch		MSEC 2021 to Highlight Leading-Edge MEMS and Sensors Innovations as IoT Spending Surges
9/14/21	Wantrich (Commercial Times) (Taiwan)		Applied Materials Unveils New Technologies to Accelerate the Semiconductor Industry's Heterogeneous Integration
9/14/21	Yahoo Stock (InfoTimes) (Taiwan)		Applied Materials Unveils New Technologies to Accelerate the Semiconductor Industry's Heterogeneous Integration
9/14/21	Yahoo Stock (Investor) (Taiwan)		The Leader in Materials Engineering Solutions for the Semiconductor - Applied Materials - Introduces Three Technologies for Accelerating Heterogeneous Integration
9/15/21	Components in Electronics		Equipment partners of IES combine their photonics expertise at SPIE Photonex + Vacuum Technologies 2021
9/15/21	Laser Focus World - FinancialContent		The Worldwide Semiconductor Bonding Industry is Expected to Reach $1.05 Billion by 2026
9/15/21	Semiconductor Engineering		Challenges With Chiplets And Packaging
9/15/21	The Daily Times Leader - FinancialContent		Best Stocks To Buy Now? 4 Tech Stocks To Watch This Week
9/17/21	Electronic Specifier		IES to attend SPIE Photonex + Vacuum Technologies 2021
9/18/21	Tencent (China)		A shares "The first stock of lithography machines" is coming! Participation in the first phase of the National Fund’s sub-funds, and the delivery of the two-stage lithography machine has been completed
9/19/21	Economic Daily (China)		After the second IPO of Huazhuo Jingke Science and Technology Innovation Board, the halo of "lithography machine concept" is no more?
9/22/21	EE Times (China)		3D Optical Sensor Industry Research Collection
9/22/21	Tencent (China)		The lithography machine of China's "core" era: "the first stock of lithography machine"! Why did Huazhuo Jingke submit the prospectus twice?
9/25/21	OLED Association		AR Device Weight Reduced Using SCHOTT RealView® 1.9
9/26/21	EE Times (China)		Summary of semiconductor product companies in various subdivisions!
9/26/21	Kesolar (China)		Multi-junction 34.1%, single-junction 24.3%! Fraunhofer ISE broke two solar cell efficiency records
9/27/21	MDPI		Influence of the Sputtering Technique and Thermal Annealing on YSZ Thin Films for Oxygen Sensing Applications
9/28/21	Solarbe (China)		Fraunhofer ISE breaks two world records for solar cell efficiency
9/29/21	21IC (China)		Summary of semiconductor product companies in various subdivisions!