EVG October 2023 Clip Report

TABLE OF CONTENTS:

Date

Source

Headline

10/5/23

Micro-Electronics Magazine (Taiwan)

EVG is Vigorously Promoting a Diversification Strategy Pursuing Both Advanced Optics and Advanced Packaging

10/6/23

Huxiu (China)

Advanced packaging, in one fell swoop

10/6/23

EE World (China)

Advanced packaging, in one fell swoop

10/8/23

Sensor Expert (China)

Advanced packaging, in one fell swoop

10/10/23

Elecfans (China)

Advanced packaging, in one fell swoop

10/15/23

icspec (China)

The battle for advanced packaging technology | Hybrid bonding has broken through sub-micron, global cooperation is deeply rooted in the hearts of the people, China cannot sit still and wait for death

10/15/23

Gelonghui.com (China)

This type of semiconductor equipment may be reshuffled!

10/15/23

Sina.com (China)

This type of semiconductor equipment may be reshuffled!

10/15/23

EE Focus (China)

The battle for advanced packaging technology | Hybrid bonding has broken through sub-micron, global cooperation is deeply rooted in the hearts of the people, China cannot sit still and wait for death

10/16/23

ICsmart (China)

Going vertical: Gate All around, 3D DRAM, 3D NAND

10/16/23

eeNews Europe

Canon looks to nanoimprint tech for 2nm lithography

10/16/23

icspec (China)

This type of semiconductor equipment may be reshuffled!

10/16/23

SemiAnalysis

Going Vertical: Gate All Around, 3D DRAM, 3D NAND - Kokusai Electric IPO

10/23/23

Elektronik / Elektroniknet.de

Billige Alternative für die EUV-Lithografie

10/24/23

Factory

Lieferengpässe bei Elektronikkomponenten: Strategien zur Krisenbewältigung

10/29/23

Toutiao (China)

In-depth report on integrated circuit packaging and testing industry: advanced packaging facilitates high-speed interconnection

10/30/23

Electronic Times (Korea)

EV Group announces ultra-thin nano-level semiconductor debonding equipment

10/31/23

Electronic Times (Korea)

Development of nano-scale semiconductor chip separation equipment – EV Group plans to announce NanoCleave around the end of the year