EVG March 2022 Clip Report

TABLE OF CONTENTS:

Date

Source

Headline

3/1/22

3DInCites

Congratulations to the Winners of the 2022 3D InCites Awards!

3/1/22

Converge! Network Digest

EVG and Teramount target wafer-level silicon photonics packaging

3/1/22

Semiconductor Today

EVG and Teramount collaborate on packaging technologies for photonic integrated circuits

3/2/22

3DInCites

EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits

3/2/22

EE Times (China)

Applied Materials and Singapore IME expand R&D cooperation, focusing on chip heterogeneous integration technology

3/2/22

Micro-Electronics (Taiwan)

Headsets Become the Key to Enter Metaverse, Overcoming the Three Major Challenges to Embrace the Unlimited Business Opportunities

3/2/22

Micro-Electronics Magazine (Taiwan)

Headsets Become the Key to Enter Metaverse, Overcoming the Three Major Challenges to Embrace the Unlimited Business Opportunities

3/2/22

Semiconductor Digest

EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits

3/2/22

Semiconductor Digest Daily

EV Group and Teramount announce collaboration to implement innovative packaging technologies for photonic integrated circuits

3/3/22

3DInCites

IMAPS DPC 2022: Community Member Preview – Keynotes, Technical Tracks and More

3/3/22

Electro Optics

EV Group and Teramount collaborate on PIC packaging technologies

3/3/22

i-Micronews

EV and Teramount announce collaboration to implement innovative packaging technologies for photonic integrated circuits

3/3/22

Oberösterreichische Nachrichten

Ausgezeichnet: So tolle Projekte gibts für Familien im Land

3/3/22

Silicon Semiconductor

EV Group And Teramount Collaborate To Implement PIC Packaging Technologies

3/3/22

TechTime

Teramount and EVG have produced optical elements for a silicon photonics connector

3/4/22

Photonics.com

NeoPhotonics Charges Forward in 800G Transceiver Race: Week in Brief: 03/04/22

3/6/22

powerelectronics (Korea)

EV Group and Teramount collaborate to implement innovative packaging technologies for photonic integrated circuits

3/7/22

Opli

EV Group and Teramount Announce Collaboration to Implement Innovative Packaging Technologies for Photonic Integrated Circuits

3/7/22

Semiconductor Packaging News

EV Group and Teramount Collaborate to Implement Packaging Technologies for Photonic Integrated Circuits

3/8/22

Commercial Micro Manufacturing Magazine

EV Group and Teramount Implement Innovative Packaging Technologies for Photonic Integrated Circuits

3/8/22

Optics & Laser Europe

OFC 2022: EV Group and Teramount developing packaging tech for PICs

3/8/22

Semiconductor Today

EVG and Teramount collaborate on packaging technologies for PICs

3/8/22

Tips

Felix Familia: Die Sieger sind gekürt

3/9/22

Laser Focus World (Japan)

EV Group and Teramount collaborate on PIC packaging technology

3/9/22

Semiconductor Digest Advanced Packaging

EV Group and Teramount announce collaboration to implement innovative packaging technologies for photonic integrated circuits

3/10/22

i-Micronews

OFC 2022: EV Group and Teramount developing packaging tech for PICs

3/11/22

3DInCites Newsletter

OFC 2022: EV Group and Teramount developing packaging tech for PICs – iMicronews

3/13/22

GoPhotonics

EVG and Teramount Collaborates to Develop New Packaging Technologies for Photonic ICs

3/15/22

3DInCites

2022 IMAPS DPC: Back and Better Than Ever

3/23/22

Electro Optics

EV Group and Teramount collaborate on PIC packaging technologies

3/29/22

EE World (China)

Read the future challenges facing Fan-out in one article

3/29/22

Laser Manufacturing Network (China)

OFC 2022 ends, 5G and AI are still hot spots

3/29/22

Ringier Industrial Resource Network (China)

OFC 2022 ends, 5G and AI are still hot spots

3/30/22

3DInCites

Taking Strides for DEI: Fund Raising Efforts Bring in 25K