EVG June 2023 Clip Report
TABLE OF CONTENTS:
Date
Source
Headline
6/1/23
Commercial Micro Manufacturing (CMM) Magazine
Leti Innovation Days to explore microelectronics' role in enabling transformational technologies
Semiconductor Today
EVG and Dymek form joint venture in Malaysia
6/2/23
Elecfans (China)
Can Wafer Bonding Surpass Moore's Law?
6/6/23
3DInCites
ECTC 2023: Quantum Computing, Hybrid Bonding, and the CHIPS for America Act
Elektronik / Elektroniknet.de
Die richtige Kombination für AR-Brillen
6/8/23
Guancha (China)
The dawn of nanoimprinting
Huxiu (China)
Lithography machine energy consumption is too high? Learn more about chip "printing"
6/9/23
Toutiao (China)
6/12/23
SEMI
Building the Workforce to Power the Semiconductor Revolution
6/18/23
EET China
From sand to core: the life of a chip
Understand in one article: the life of a chip
6/19/23
EE World (China)
6/20/23
APA-OTS
WKÖ-Gewerbe und Handwerk gratuliert EV Group zum Exportpreis 2023
Exportpreis 2023: WKÖ prämiert herausragende Leistungen der Exportwirtschaft
Börse Social Network
Top News
WIRTSCHAFTSZEIT
Export-Unternehmen für herausragende Leistungen ausgezeichnet
Wirtschaftskammer Österreich zeichnet Leistungen der Exportwirtschaft aus
6/21/23
0XZX (China)
Intel Nets $4.3B By Selling 20% Of Chipmaking Tech Provider IMS
BNN Bloomberg
Intel to Sell 20% of IMS to Bain at $4.3 Billion Valuation
eeNews Europe
Intel spins out $4.3bn chip mask making business in Europe
I3 Investor (Malaysia)
Intel to Sell 20% of IMS to Bain at US$4.3 Billion Valuation
IT Home (China)
SiliconANGLE
Intel bags $4.3B by selling 20% stake in chip manufacturing technology supplier IMS
The Edge (Malaysia) (Malaysia)
Intel to sell 20% of IMS to Bain at US$4.3 billion valuation
6/22/23
Gulf Business
Intel to sell 20% of IMS to Bain at $4.3bn valuation
LUPA.cz
From Central Europe will be a giant chip center, (China) Telecom in the Czech Republic, jump into development for Vision Pro
meinbezirk.at
Kategorie Gewerbe und Handwerk
6/23/23
SEMI 3D & Systems Summit Community Member Preview
6/26/23
EE Journal
SEMI 3D & Systems Summit 2023 Opens With Heterogeneous Integration for Smarter Systems in Focus
HPC Wire
EMI 3D & Systems Summit 2023 Opens with Heterogeneous Integration for Smarter Systems in Focus
Semiconductor Digest
6/27/23
EV Group Scores Big with Eleventh Consecutive Triple Crown Win in TechInsights 2023 Customer Satisfaction Survey
6/28/23
Community Member Monthly Highlights — June
35000+ words! This is the most comprehensive article I have ever written on the semiconductor industry chain! (recommend)
EVG earns 11th consecutive triple win in TechInsights’ 2023 Customer Satisfaction Survey
6/30/23